Industrial 650V 4-pack super-junction MOSFET module using transfer molding process
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lim, Jangmuk | - |
dc.contributor.author | Seong, Jihwan | - |
dc.contributor.author | Yoon, Sang Won | - |
dc.contributor.author | Kim, You Suk | - |
dc.contributor.author | Im, Hun-Chang | - |
dc.contributor.author | Hong, Won Sik | - |
dc.date.accessioned | 2021-07-30T05:22:58Z | - |
dc.date.available | 2021-07-30T05:22:58Z | - |
dc.date.created | 2021-05-13 | - |
dc.date.issued | 2019-09 | - |
dc.identifier.issn | 2329-3721 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/4527 | - |
dc.description.abstract | This paper reports a new design of a 4-pack super-junction MOSFET power module using a transfer molding process. This module initially targets industrial applications, such as photovoltaic (PV) inverters or energy storage system (ESS). Many conventional 650V power modules are gel-filled IGBT modules, but our transfer molded super-junction MOSFET power module can satisfy electrical insulation and thermal conductivity with potential reduction in production cost and module volume. Super-junction MOSFET dies are soldered on a direct bonded copper (DBC) substrate in the power module. Fabrication process is also customized to the molded super-junction MOSFET module. The designed power modules are successfully fabricated, demonstrating a volume reduction. The fabricated modules are evaluated by FEM simulations and experiments, which exhibit excellent thermal and electrical performances. A small thermal resistance (similar to 0.26 IC/W) and package on-resistance (similar to 15.7m Omega) are achieved. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
dc.title | Industrial 650V 4-pack super-junction MOSFET module using transfer molding process | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Yoon, Sang Won | - |
dc.identifier.doi | 10.1109/ECCE.2019.8912910 | - |
dc.identifier.scopusid | 2-s2.0-85076719312 | - |
dc.identifier.bibliographicCitation | 2019 IEEE Energy Conversion Congress and Exposition, ECCE 2019, pp.4097 - 4101 | - |
dc.relation.isPartOf | 2019 IEEE Energy Conversion Congress and Exposition, ECCE 2019 | - |
dc.citation.title | 2019 IEEE Energy Conversion Congress and Exposition, ECCE 2019 | - |
dc.citation.startPage | 4097 | - |
dc.citation.endPage | 4101 | - |
dc.type.rims | ART | - |
dc.type.docType | Conference Paper | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Energy & Fuels | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalWebOfScienceCategory | Energy & Fuels | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.subject.keywordAuthor | 4-Pack Power Module | - |
dc.subject.keywordAuthor | Junction to Case Thermal Resistance | - |
dc.subject.keywordAuthor | Package on-resistance | - |
dc.subject.keywordAuthor | Stray Inductance | - |
dc.subject.keywordAuthor | Super-Junction MOSFET | - |
dc.subject.keywordAuthor | Transfer Molding | - |
dc.identifier.url | https://ieeexplore.ieee.org/document/8912910 | - |
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