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Reliability on the Contact Resistance of the Joints for 3D TSV application
- Authors
- 김영호
- Issue Date
- 18-Jan-2014
- Publisher
- Hong Kong Industrial Technology Research Centre
- Citation
- 2014 International Forum on Materials Processing Technology
- Conference Name
- 2014 International Forum on Materials Processing Technology
- Place
- Guangzhou, China
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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