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Effect of Eco-friendly Cu-Zn Wetting Layers on Board Level Drop Impact Reliability of Sn-Ag-Cu Solder Joint
- Authors
- 김영호
- Issue Date
- 7-Oct-2013
- Publisher
- The Korean Microelectronis and Packaging Society
- Citation
- EMAP 2013 (15th International Conference On Electronic Materials and Packaging)
- Conference Name
- EMAP 2013 (15th International Conference On Electronic Materials and Packaging)
- Place
- 일산 KINTEX
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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