Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Development of Highly Reliable Flip-chip Bonding Technology using Non-conductive Adhesives (NCAs) for 20 um Pitch Application
Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김영호 | - |
| dc.date.accessioned | 2021-08-03T12:35:18Z | - |
| dc.date.available | 2021-08-03T12:35:18Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 2013-05-30 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/47998 | - |
| dc.publisher | IEEE | - |
| dc.title | Development of Highly Reliable Flip-chip Bonding Technology using Non-conductive Adhesives (NCAs) for 20 um Pitch Application | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 김영호 | - |
| dc.identifier.bibliographicCitation | Electronic Components & Technology Conference (ECTC) 2013 | - |
| dc.relation.isPartOf | Electronic Components & Technology Conference (ECTC) 2013 | - |
| dc.citation.title | Electronic Components & Technology Conference (ECTC) 2013 | - |
| dc.citation.conferencePlace | The Cosmopolitan of Las Vegas, Nevada, USA | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.