Communication—Synergistic Effect of Mixed Particle Size on W CMP Process: Optimization Using Experimental Design
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Seo, Jihoon | - |
dc.contributor.author | Moon, Jinok | - |
dc.contributor.author | Kim, Yehwan | - |
dc.contributor.author | Kim, Kijung | - |
dc.contributor.author | Lee, Kangchun | - |
dc.contributor.author | Cho, Yoonsung | - |
dc.contributor.author | Lee, Dong-Hee | - |
dc.contributor.author | Paik, Ungyu | - |
dc.date.accessioned | 2021-07-30T05:26:05Z | - |
dc.date.available | 2021-07-30T05:26:05Z | - |
dc.date.created | 2021-05-12 | - |
dc.date.issued | 2017 | - |
dc.identifier.issn | 2162-8769 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/4844 | - |
dc.description.abstract | We have investigated the synergistic effect with mixing of three different-sized SiO2 abrasives (30 nm-SiO2, 70 nm-SiO2 and 200 nm-SiO2) and the corresponding W chemical mechanical planarization (CMP) performances. W removal rate significantly increased when the different-sized SiO2 abrasives were mixed, which is attributed to the increase in the total contact area between the abrasives and the W film. Based on the statistical model, we obtained the optimal mixing ratio (30 nm, 70 nm, 200 nm) = (0.49, 0.23, 0.28) for the highest W removal rate. These results, investigated in this study, show that the removal rate of W film can be improved via simple mixing process. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | ELECTROCHEMICAL SOC INC | - |
dc.title | Communication—Synergistic Effect of Mixed Particle Size on W CMP Process: Optimization Using Experimental Design | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Lee, Dong-Hee | - |
dc.contributor.affiliatedAuthor | Paik, Ungyu | - |
dc.identifier.doi | 10.1149/2.0171701jss | - |
dc.identifier.scopusid | 2-s2.0-85009814490 | - |
dc.identifier.wosid | 000393981600027 | - |
dc.identifier.bibliographicCitation | ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, v.6, no.1, pp.P42 - P44 | - |
dc.relation.isPartOf | ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY | - |
dc.citation.title | ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY | - |
dc.citation.volume | 6 | - |
dc.citation.number | 1 | - |
dc.citation.startPage | P42 | - |
dc.citation.endPage | P44 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.isOpenAccess | N | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Physics | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Physics, Applied | - |
dc.subject.keywordPlus | CHEMICAL-MECHANICAL PLANARIZATION | - |
dc.subject.keywordPlus | ABRASIVES | - |
dc.subject.keywordAuthor | Chemical mechanical planarization | - |
dc.subject.keywordAuthor | Experimental design | - |
dc.subject.keywordAuthor | Mixed abrasive slurries | - |
dc.subject.keywordAuthor | Optimization | - |
dc.subject.keywordAuthor | Synergistic effect | - |
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