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3차원 구조 NAND flash memory의 mechanical stress 분포 및 온도 영향성에 관한 연구A study of mechanical stress distribution and temperature effect in three dimensional NAND flash memory
- Other Titles
- A study of mechanical stress distribution and temperature effect in three dimensional NAND flash memory
- Issue Date
- Jun-2016
- Publisher
- 대한전자공학회
- Citation
- 대한전자공학회 학술대회, pp.422 - 425
- Indexed
- OTHER
- Journal Title
- 대한전자공학회 학술대회
- Start Page
- 422
- End Page
- 425
- ISSN
- 12296368
- Abstract
- According to Moor’s law, Scaling of NAND flash memory was continued but nowadays two dimensional structure was reached the physical limit. Consequently three dimensional structure was researched and produced. Mechanical stress occurs reliability problem and change electrical characteristics. Especially in multi-layer structure, mechanical stress is one of the most important factor that determines cell characteristics and reliability. In this paper, we investigate mechanical stress distribution and effect of annealing temperature in 3D NAND flash memory.
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Collections - 서울 공과대학 > 서울 융합전자공학부 > 1. Journal Articles
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Related Researcher
- Song, Yun Heub
- COLLEGE OF ENGINEERING (SCHOOL OF ELECTRONIC ENGINEERING)