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A Numerical Study for Laser-induced Thermal Cracking in Silicon Wafer
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 장경영 | - |
| dc.date.accessioned | 2021-08-03T14:49:29Z | - |
| dc.date.available | 2021-08-03T14:49:29Z | - |
| dc.date.issued | 2012-06-20 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/51348 | - |
| dc.title | A Numerical Study for Laser-induced Thermal Cracking in Silicon Wafer | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | The 4th International Conference on Design and Analysis of Protective Structures | - |
| dc.citation.conferencePlace | 제주 | - |
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