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Wetting characteristics of Cu-xZn layers for Sn-3.0Ag-0.5Cu solders
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김영호 | - |
| dc.date.accessioned | 2021-08-03T15:33:53Z | - |
| dc.date.available | 2021-08-03T15:33:53Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 2012-04-18 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/52310 | - |
| dc.publisher | Institute of Electrical and Electronics Engineers | - |
| dc.title | Wetting characteristics of Cu-xZn layers for Sn-3.0Ag-0.5Cu solders | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 김영호 | - |
| dc.identifier.bibliographicCitation | 12th Inyernational Conference on Electronics Packaging (ICEP) | - |
| dc.relation.isPartOf | 12th Inyernational Conference on Electronics Packaging (ICEP) | - |
| dc.citation.title | 12th Inyernational Conference on Electronics Packaging (ICEP) | - |
| dc.citation.conferencePlace | Tokyo Big Sight, Tokyo, Japan | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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