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Development of 20 µm Pitch COG Joints Fabricated Using Sn/Cu Bumps and NCAs
- Authors
- 김영호
- Issue Date
- 18-Oct-2011
- Publisher
- The Minerals Metals & Materials Society (TMS)
- Citation
- Materials Science and Technology (MS&T) 2011
- Conference Name
- Materials Science and Technology (MS&T) 2011
- Place
- Columbus, Ohio, USA
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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