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Effect of Pad Finish on the Reliability of Cu Bumps Fabricated Using Cu3Sn and ENIG Capping Layers for TSV Applications
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김영호 | - |
| dc.date.accessioned | 2021-08-03T16:35:26Z | - |
| dc.date.available | 2021-08-03T16:35:26Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 2011-10-17 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/53940 | - |
| dc.publisher | The Minerals Metals & Materials Society (TMS) | - |
| dc.title | Effect of Pad Finish on the Reliability of Cu Bumps Fabricated Using Cu3Sn and ENIG Capping Layers for TSV Applications | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 김영호 | - |
| dc.identifier.bibliographicCitation | Materials Science and Technology (MS&T) 2011 | - |
| dc.relation.isPartOf | Materials Science and Technology (MS&T) 2011 | - |
| dc.citation.title | Materials Science and Technology (MS&T) 2011 | - |
| dc.citation.conferencePlace | Columbus, Ohio, USA | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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