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Effect of Solder Pad on the Fatigur Life of FBGA Memory Modules Under Harmonic Excitation by Using Global-Local Modeling Technique
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 장건희 | - |
| dc.date.accessioned | 2021-08-03T17:32:54Z | - |
| dc.date.available | 2021-08-03T17:32:54Z | - |
| dc.date.issued | 2011-05-26 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/55191 | - |
| dc.title | Effect of Solder Pad on the Fatigur Life of FBGA Memory Modules Under Harmonic Excitation by Using Global-Local Modeling Technique | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | K-J Symposium 2011 | - |
| dc.citation.conferencePlace | Busan, Korea | - |
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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