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The Effect of Pd Thickness in the Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold Surface Finish and Their Mechanical Properties
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김영호 | - |
| dc.date.accessioned | 2021-08-03T17:52:41Z | - |
| dc.date.available | 2021-08-03T17:52:41Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 2011-03-03 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/56039 | - |
| dc.publisher | TMS | - |
| dc.title | The Effect of Pd Thickness in the Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold Surface Finish and Their Mechanical Properties | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 김영호 | - |
| dc.identifier.bibliographicCitation | TMS 2011 | - |
| dc.relation.isPartOf | TMS 2011 | - |
| dc.citation.title | TMS 2011 | - |
| dc.citation.conferencePlace | San Diego, CA, USA | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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