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Development of ultra fine pitch Chip-on-Glass (COG) bonding with metal bumps having insulating layer in the side wall using Anisotropic conductive Adhesives (ACAs)
- Authors
- 김영호
- Issue Date
- 23-Nov-2010
- Publisher
- The Korean Institute of Metals and Materials
- Citation
- ENGE2010, international conference on Electronic Materials and Nanotechnology for Green Environment
- Conference Name
- ENGE2010, international conference on Electronic Materials and Nanotechnology for Green Environment
- Place
- Jeju island, Korea
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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