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Interfacial Reaction of Sn-3.0Ag-0.5Cu solder with sputtered Ni-Zn under bump metallurgy during soldering and aging
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김영호 | - |
| dc.date.accessioned | 2021-08-03T18:22:02Z | - |
| dc.date.available | 2021-08-03T18:22:02Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 2010-11-23 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/56559 | - |
| dc.publisher | The Korean Institute of Metals and Materials | - |
| dc.title | Interfacial Reaction of Sn-3.0Ag-0.5Cu solder with sputtered Ni-Zn under bump metallurgy during soldering and aging | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 김영호 | - |
| dc.identifier.bibliographicCitation | ENGE2010, international conference on Electronic Materials and Nanotechnology for Green Environment | - |
| dc.relation.isPartOf | ENGE2010, international conference on Electronic Materials and Nanotechnology for Green Environment | - |
| dc.citation.title | ENGE2010, international conference on Electronic Materials and Nanotechnology for Green Environment | - |
| dc.citation.conferencePlace | Jeju island, Korea | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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