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Study on Low Polishing Rate Selectivity of 2nd step for Compensation of Cu Dishing during 1st Step Cu CMP Process
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 박재근 | - |
| dc.date.accessioned | 2021-08-03T18:33:06Z | - |
| dc.date.available | 2021-08-03T18:33:06Z | - |
| dc.date.issued | 2010-11-15 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/56707 | - |
| dc.title | Study on Low Polishing Rate Selectivity of 2nd step for Compensation of Cu Dishing during 1st Step Cu CMP Process | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | ICPT 2010 | - |
| dc.citation.conferencePlace | USA/ Arizona Biltmore Resort & Spa | - |
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Collections - 서울 공과대학 > 서울 융합전자공학부 > 2. Conference Papers
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