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Vibration analysis of FBGA solder joints of the memory module subjected to harmonic excitation
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 장건희 | - |
| dc.date.accessioned | 2021-08-03T19:49:38Z | - |
| dc.date.available | 2021-08-03T19:49:38Z | - |
| dc.date.issued | 2010-05-13 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/58819 | - |
| dc.title | Vibration analysis of FBGA solder joints of the memory module subjected to harmonic excitation | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 2010년 춘계학술대회논문집 | - |
| dc.citation.conferencePlace | 제주 | - |
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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