Thermal Impedance Measurement Utilizing Optical Measurement and Thermal Impedance Model for Multichip SiC MOSFET Module with Anti-Parallel Diodes
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Min Ki | - |
dc.contributor.author | Yoon, Sang Won | - |
dc.date.accessioned | 2021-07-30T08:08:00Z | - |
dc.date.available | 2021-07-30T08:08:00Z | - |
dc.date.created | 2021-07-16 | - |
dc.date.issued | 2021-05-06 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/5994 | - |
dc.description.abstract | This paper presents a method of extracting thermal impedance for multi-chip SiC MOSFET power modules with anti-parallel diodes. This method co-utilizes thermal optical measurement and thermal impedance model. Thermo-sensitive electrical parameter(TSEP) is commonly employed but becomes relatively inaccurate, especially in multichip applications. Our proposed method directly measures the junction temperature(Tj) using a fiber optic temperature sensor. Though the fiber optic has a relatively slow response than TSEP, the undetected regions are compensated by an estimation approach using a thermal model and analyzed. The proposed method can accurately measure thermal resistance. Additional circuits and calibrations are not required. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | Mesago Messe Frankfurt GmbH | - |
dc.title | Thermal Impedance Measurement Utilizing Optical Measurement and Thermal Impedance Model for Multichip SiC MOSFET Module with Anti-Parallel Diodes | - |
dc.type | Conference | - |
dc.contributor.affiliatedAuthor | Yoon, Sang Won | - |
dc.identifier.bibliographicCitation | PCIM Europe digital days 2021, pp.1700 - 1706 | - |
dc.relation.isPartOf | PCIM Europe digital days 2021 | - |
dc.relation.isPartOf | PCIM Europe digital days 2021; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management | - |
dc.citation.title | PCIM Europe digital days 2021 | - |
dc.citation.startPage | 1700 | - |
dc.citation.endPage | 1706 | - |
dc.citation.conferencePlace | US | - |
dc.citation.conferencePlace | 온라인 컨퍼런스 | - |
dc.citation.conferenceDate | 2021-05-03 | - |
dc.type.rims | CONF | - |
dc.description.journalClass | 1 | - |
dc.identifier.url | https://ieeexplore.ieee.org/document/9472452 | - |
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