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Patterning of Ag thin films with micro Transfer Molding
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 성명모 | - |
| dc.date.accessioned | 2021-08-03T20:49:14Z | - |
| dc.date.available | 2021-08-03T20:49:14Z | - |
| dc.date.issued | 2009-10-30 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/60283 | - |
| dc.description.abstract | We report a new metal particle transfer printing method using inkpad method. In this technique, an elastomeric stamp is prepared by casting against a master. A Ag particle pad is formed on the oxidized surface of the substrate by spin coating. The patterned PDMS contacts to the metal particle ink pad a few seconds. When the PDMS lifted up, the metal particle on the raised regions of the stamp is transferred to the oxide substrate and a metal pattern is formed. The Ag particle-coated prepatterned PDMS can make conformal contact with SiO2 substrate. The patterned Silver films have been investigated by atomic force microscopy (AFM), optical microscopy (OM) and scanning electron microscopy (SEM). | - |
| dc.title | Patterning of Ag thin films with micro Transfer Molding | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 대한화학회 제104회 총회 및 학술발표회 | - |
| dc.citation.conferencePlace | 대전컨벤션센터 | - |
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