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Patterning of Ag thin films with micro Transfer Molding

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dc.contributor.author성명모-
dc.date.accessioned2021-08-03T20:49:14Z-
dc.date.available2021-08-03T20:49:14Z-
dc.date.issued2009-10-30-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/60283-
dc.description.abstractWe report a new metal particle transfer printing method using inkpad method. In this technique, an elastomeric stamp is prepared by casting against a master. A Ag particle pad is formed on the oxidized surface of the substrate by spin coating. The patterned PDMS contacts to the metal particle ink pad a few seconds. When the PDMS lifted up, the metal particle on the raised regions of the stamp is transferred to the oxide substrate and a metal pattern is formed. The Ag particle-coated prepatterned PDMS can make conformal contact with SiO2 substrate. The patterned Silver films have been investigated by atomic force microscopy (AFM), optical microscopy (OM) and scanning electron microscopy (SEM).-
dc.titlePatterning of Ag thin films with micro Transfer Molding-
dc.typeConference-
dc.citation.conferenceName대한화학회 제104회 총회 및 학술발표회-
dc.citation.conferencePlace대전컨벤션센터-
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서울 자연과학대학 > 서울 화학과 > 2. Conference Papers

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