Patterning of Aluminum Thin Film using Solvent assisted nano Transfer Printing

Abstract

We report a new metal transfer printing method that uses a water-mediated transfer process with contact inking stamps. Water-mediated nTP is based on the direct transfer of a metal thin film from a stamp to a substrate via a water-mediated surface bonding between the stamp and the substrate. In water-mediated transfer printing, the water layer serves as an adhesion layer to provide good conformal contact and form strong covalent bonding between the Al thin film and the Si substrate. The transferred Al patterns are chemically bound to the substrate surface and, thus, exhibit strong adhesion. The SAMs ensures efficient release of the Al pattern when the stamp is removed. When the PDMS lifted up, the metal on the raised regions of the stamp is transferred to the oxide substrate and a metal pattern is formed. The Al-coated patterned PDMS can make conformal contact with SiO2 substrate. The patterned Al films have been investigated by atomic force microscopy (AFM) and scanning electron microscopy (SEM).