A new Cu-Zn solder wetting layer for improved impact reliability
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김영호 | - |
dc.date.accessioned | 2021-08-03T21:38:25Z | - |
dc.date.available | 2021-08-03T21:38:25Z | - |
dc.date.created | 2021-06-30 | - |
dc.date.issued | 2009-05-28 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/61637 | - |
dc.publisher | CMPT, IEEE | - |
dc.title | A new Cu-Zn solder wetting layer for improved impact reliability | - |
dc.type | Conference | - |
dc.contributor.affiliatedAuthor | 김영호 | - |
dc.identifier.bibliographicCitation | the 59th Electronic Components and Technology conference | - |
dc.relation.isPartOf | the 59th Electronic Components and Technology conference | - |
dc.citation.title | the 59th Electronic Components and Technology conference | - |
dc.citation.conferencePlace | San Diego, USA | - |
dc.type.rims | CONF | - |
dc.description.journalClass | 1 | - |
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