Highly Ordered Nanowire Arrays on Patterned Substrates by using Light Stamping Lithography

Abstract

We report a new metal transfer printing method that uses a water-mediated transfer process with a lift-up method. Water mediated NTP is based on the lift-up and the direct transfer of a metal thin film from a stamp to a substrate via water-mediated surface bonding. In this printing method, the water layer serves as an adhesion layer to provide good conformal contact and form strong covalent bonding between the Al thin film and the Si substrate. The transferred Al patterns are chemically bound to the substrate surface and, thus, exhibit strong adhesion. This procedure can generate aluminum(Al) patterns with micrometer and nanometer-scale feature size. Furthermore, an array of Al nanochannels is fabricated by using this method. The patterned Al films have been investigated by AFM and SEM.