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The effect of thickness of Cu-Zn solder wetting layer on the intermetallic growth
- Authors
- 김영호
- Issue Date
- 16-Feb-2009
- Publisher
- TMS
- Citation
- TMS 2009 138th annual meeting & exhibition
- Conference Name
- TMS 2009 138th annual meeting & exhibition
- Place
- San Francisco, CA, USA
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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