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Effect of Alkaline Agent with Organic Additive in Colloidal Silica Slurry on Polishing Rate Selectivity of Poly-Si to Oxide in Poly-Si CMP
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 백운규 | - |
| dc.date.accessioned | 2021-08-03T23:48:32Z | - |
| dc.date.available | 2021-08-03T23:48:32Z | - |
| dc.date.issued | 2008-05-20 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/64710 | - |
| dc.title | Effect of Alkaline Agent with Organic Additive in Colloidal Silica Slurry on Polishing Rate Selectivity of Poly-Si to Oxide in Poly-Si CMP | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 213th ECS Meeting | - |
| dc.citation.conferencePlace | Phoenix Covention Center(USA) | - |
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Collections - 서울 공과대학 > 서울 에너지공학과 > 2. Conference Papers
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Related Researcher
- Paik, Ungyu
- COLLEGE OF ENGINEERING (DEPARTMENT OF ENERGY ENGINEERING)