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Conduction Through Molecular Wires Bridged between Au Nanoparticles Dispersed in Au/Si02 Nanocomposite Film

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dc.contributor.author김영도-
dc.date.accessioned2021-08-04T00:22:25Z-
dc.date.available2021-08-04T00:22:25Z-
dc.date.issued20080123-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/65519-
dc.description.abstractThere are numerous reports of exploratory researches abouts electrical properties of molecules by theroretical or experimental approaches. in spite of such efforts, wiring of molecules is still an important problem for a practical application as well as selective alignment of molecules. nanogap electrodes are one of possible methods for a practical application. however, preparation of a gap less than 10nm,required for direct connection between metal junctions with molecules, is not easy to be achieved. thus, there is a possible consideration to connect between nanogap electrodes of distance longer than molecular length, using au nanoparticles distributed in the nanogap. the au nanoparticles could be stepping stones for the molecules to bridge and electrically connect between the nanogap electrodes linked to the outer circuit. in this study, 4,4 bis biphenylene was introduced between the au nanoparticles dispersed in nanocomposite deposited on the electrodes gap and then molecular conduction was characterized-
dc.titleConduction Through Molecular Wires Bridged between Au Nanoparticles Dispersed in Au/Si02 Nanocomposite Film-
dc.typeConference-
dc.citation.conferenceNameAdvanced Processing of Novel Functional Materials-
dc.citation.conferencePlaceDresden, Germany-
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서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers

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