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Fabrication of ZnS-SiO2 sputtering target and its properties
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김영도 | - |
| dc.date.accessioned | 2021-08-04T00:50:19Z | - |
| dc.date.available | 2021-08-04T00:50:19Z | - |
| dc.date.issued | 2007-10-10 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/66630 | - |
| dc.description.abstract | Raw ZnS and ZnS-SiO2 powder prepared by a 3-D mixer or high energy ball-milling were successfully densified by spark plasma sintering. The mechanical properties were evaluated by microhardness and fracture toughness and correlated to the microstructure. In case of the ball-milled ZnS-SiO2 powder, mechanical properties were the highest as a result of a finer and more homogeneous microstructure. Due to the effect of dispersion hardening and crack deflection by the second phase of fine SiO2, the hardness and fracture toughness reached 3.031 GPa and 1.014 MPa·m0.5, respectively. | - |
| dc.title | Fabrication of ZnS-SiO2 sputtering target and its properties | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | The seventh international workshop on microelectronics assembling and packaging | - |
| dc.citation.conferencePlace | West Japan General Wxhibition center fukuoka, Japan | - |
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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