Fabrication of W-Cu Composite for the Heat-sink Materials

Abstract

W-Cu composites are used for thermal and electrical applications such as ultrahigh-voltage electric contact materials, microelectronic applications like blocking materials for microwave packages and heat-sink materials for high density integrated circuits due to the high thermal conductivity of Cu and the low coefficient of thermal expansion of W. W-15wt.% Cu nanocomposite powder samples were fabricated by ball-milling and subsequent hydrogen-reduction. The powder samples were sintered with different heating rate. Thermal conductivity was evaluated from thermal diffusivities by laser flash method. The thermal conductivity is affected by the microstructure resulting from the homogeneity of the sintered microstructure.