A Novel Fabrication Method of Cu Coaxial Nanocable With Al2O3 Insulation by Using Atomic Layer Deposition and Electrodeposition

Abstract

We present a novel approach for the fabrication of Cu/Al2O3 nanocables by using atomic layer deposition (ALD) of Al2O3 and electrodeposition of Cu with a nanoporous polycarbonate (PC) membrane as a template. The Al2O3 thin films were successfully coated only onto the inner-wall of PC template by ALD at 140℃. The Cu metals were then electrodeposited into the pore of the Al2O3-coated PC template, and the PC filters were etched away using the solution of chloroform. The Cu/Al2O3 nanocables were successfully fabricated with ultra-precise control of the Al2O3 wall thickness, so as to inner diameter of the Cu wire. Our novel Fabrication method can provide a unique process to make a precisely size-controlled metal coaxial nanocable with insulation.