Metaltransfer Printing Using Inkpad method

Abstract

Advanced techniques for nanofabrication are now essential for progress in many areas of science and technology. Substantial research focuses on surface chemistries and materials that can extend the resolution of printing and writing techniques into the submicron regime. One goal of these efforts is to establish nanofabrication techniques that have capabilities which can complement the strengths of methods designed for semiconductor manufacturing (e.g. electron beam lithography, photolithography, etc.). For example, microcontact printing (mCP) and dip pen nanolithography (DPN) represent two relatively new methods that combine high resolution "stamps" and "pens" with self-assembled monolayer (SAM) "inks" for high-resolution patterning. These and other emerging techniques are rapidly becoming important for a range of applications. Metaltransfer Printing is conceptually similar to microcontact printing. Unlike mCP, MTP does not suffer from surface diffusion or edge disorder in patterned SAM "inks" nor does it require post-printing etching or deposition steps to produce structures of functional materials. This Metaltransfer printing technique relies on tailored surface chemistries to transfer metal films from the raised regions of a stamp to a substrate when these two elements are brought into intimate physical contact. We demonstrate patterned metal films formed by Metaltransfer printing (MTP). We use of OTS-SAMs and TiO2 as covalent "release" and "glue"layers for transferring material from relief features on a stamp to a substrate. The patterned Al thin films have been characterized by atomic force microscopy (AFM),scanning electron microscopy (SEM) and Optical microscopy.