Submicron- and nano-scale patterning of polydimethylsiloxane resist structures on electronic materials using decal transfer lithography and reactive ion etching

Abstract

We describe a novel soft-lithographic technique possessing broad utility for the fabrication of large area, nanoscale (~100 nm) multilayer resist structures on electronic material substrates. This additive patterning method transfers ultrathin poly(dimethylsiloxane) (PDMS) decals to an underlying SiO2-capped organic planarazation layer. The PDMS patterns serve as a latent image through which high-quality multilayer resist structures can be developed using reactive ion-beam etching.