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Effect of Nano-Colloidal Abrasive size on Removal Rate and Selectivity of Cu/TaN Film in Cu CMP
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 백운규 | - |
| dc.date.accessioned | 2021-08-04T04:38:41Z | - |
| dc.date.available | 2021-08-04T04:38:41Z | - |
| dc.date.issued | 2005-05-27 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/72427 | - |
| dc.title | Effect of Nano-Colloidal Abrasive size on Removal Rate and Selectivity of Cu/TaN Film in Cu CMP | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 한국재료학회 춘계학술발표대회 | - |
| dc.citation.conferencePlace | 무주리조트 티롤호텔 | - |
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Collections - 서울 공과대학 > 서울 에너지공학과 > 2. Conference Papers
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Related Researcher
- Paik, Ungyu
- COLLEGE OF ENGINEERING (DEPARTMENT OF ENERGY ENGINEERING)