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The Effects of Water-Soluble Oragnic Additives on the Rhelogical Behavior of Colloidal Silica Slurry and Its Influence on Wafer Polishing Process
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 박재근 | - |
| dc.date.accessioned | 2021-08-04T05:54:28Z | - |
| dc.date.available | 2021-08-04T05:54:28Z | - |
| dc.date.issued | 2004-06-04 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/74494 | - |
| dc.title | The Effects of Water-Soluble Oragnic Additives on the Rhelogical Behavior of Colloidal Silica Slurry and Its Influence on Wafer Polishing Process | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | International Conference on Crystal Growth And LED Epi and Substrate | - |
| dc.citation.conferencePlace | Sungkyunkwan University, Suwon, Korea | - |
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