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The Rheological behavior of colloidal sillica slurry and its influence on wafer polishing process
- Authors
- 백운규
- Issue Date
- 19-Apr-2004
- Place
- Indianapolis
- Conference Name
- The 106th Annual Meeting & Exposition of The American Ceramic Society
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Collections - 서울 공과대학 > 서울 에너지공학과 > 2. Conference Papers
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Related Researcher
- Paik, Ungyu
- COLLEGE OF ENGINEERING (DEPARTMENT OF ENERGY ENGINEERING)