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The Rheological Behavior of Colloidal Silica Slurry and Its Influence on Wafer Polishing Process
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 박재근 | - |
| dc.date.accessioned | 2021-08-04T06:21:04Z | - |
| dc.date.available | 2021-08-04T06:21:04Z | - |
| dc.date.issued | 2004-04-19 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/75082 | - |
| dc.title | The Rheological Behavior of Colloidal Silica Slurry and Its Influence on Wafer Polishing Process | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 106th Annual Meeting & Exposition of the American Ceramic Society | - |
| dc.citation.conferencePlace | Indiana Convention Center & RCA Dome, Indianapolis, Indiana, USA | - |
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Collections - 서울 공과대학 > 서울 융합전자공학부 > 2. Conference Papers
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