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The Effect of Rheological Behavior of Collidal Silica Slurry with Organic Addittive on Wafer Polishing Process
- Authors
- 박재근
- Issue Date
- 17-Apr-2004
- Place
- Korea University, Seoul, Korea
- Conference Name
- 2004 spring meeting of Korean Ceramic Society
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Collections - 서울 공과대학 > 서울 융합전자공학부 > 2. Conference Papers
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