A Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 전형탁 | - |
dc.date.accessioned | 2021-08-04T06:37:21Z | - |
dc.date.available | 2021-08-04T06:37:21Z | - |
dc.date.issued | 20031105 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/75672 | - |
dc.title | A Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect | - |
dc.type | Conference | - |
dc.citation.conferenceName | AVS 50th International Symposium & Exhibition | - |
dc.citation.conferencePlace | Baltimore, Maryland U.S.A | - |
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