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Reaction between Sn-In solder and bump metallurgy
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김영호 | - |
| dc.date.accessioned | 2021-08-04T06:37:22Z | - |
| dc.date.available | 2021-08-04T06:37:22Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 2003-11-05 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/75674 | - |
| dc.description.abstract | LCD has been widely used as plat panel disply for cellular phones, PDA systems, and notebook coumputers because of its low power consumption,slim size, and lightness. | - |
| dc.publisher | ISAEM2003 | - |
| dc.title | Reaction between Sn-In solder and bump metallurgy | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 김영호 | - |
| dc.identifier.bibliographicCitation | The 3rd international symposium on designing, processing and properties of advanced engineeri | - |
| dc.relation.isPartOf | The 3rd international symposium on designing, processing and properties of advanced engineeri | - |
| dc.citation.title | The 3rd international symposium on designing, processing and properties of advanced engineeri | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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