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Electrical Properties of Ultrasmall Low Temperature Solder Joints for LCD Driver ICPackaging ApplicationsElectrical Properties of Ultrasmall Low Temperature Solder Joints for LCD Driver ICPackaging Applications
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김영호 | - |
| dc.date.accessioned | 2021-08-04T07:35:10Z | - |
| dc.date.available | 2021-08-04T07:35:10Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 2002-12-04 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/77022 | - |
| dc.description.abstract | We developed a fine pitch COG technique using the low temperature solder bumps for LCD driver IC packaging applications. Using the eutectic Bi-Sn and the eutectic In-Ag solder bumps of 80-50 ㎛ pitch sizes, a ultrafine solder joint between IC and glass substrate was successfully made at or below 160℃. The contact resistance of the solder joint of 50 ㎛ pitch was 42 mΩ, which was much lower than that of the joint made using the conventional ACF bonding technique. | - |
| dc.publisher | KAIST | - |
| dc.title | Electrical Properties of Ultrasmall Low Temperature Solder Joints for LCD Driver ICPackaging ApplicationsElectrical Properties of Ultrasmall Low Temperature Solder Joints for LCD Driver ICPackaging Applications | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 김영호 | - |
| dc.identifier.bibliographicCitation | EMAP2002 | - |
| dc.relation.isPartOf | EMAP2002 | - |
| dc.citation.title | EMAP2002 | - |
| dc.citation.conferencePlace | Taiwan | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
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