Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Fine Pitch, Low Temperature Solder Bump Formation by using Lift-Off Process
Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 정용재 | - |
| dc.date.accessioned | 2021-08-04T09:51:43Z | - |
| dc.date.available | 2021-08-04T09:51:43Z | - |
| dc.date.created | 2021-06-30 | - |
| dc.date.issued | 1999-12-10 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/80827 | - |
| dc.publisher | Gintic | - |
| dc.title | Fine Pitch, Low Temperature Solder Bump Formation by using Lift-Off Process | - |
| dc.type | Conference | - |
| dc.contributor.affiliatedAuthor | 정용재 | - |
| dc.identifier.bibliographicCitation | Symposium on Advances in Packaging | - |
| dc.relation.isPartOf | Symposium on Advances in Packaging | - |
| dc.citation.title | Symposium on Advances in Packaging | - |
| dc.citation.conferencePlace | Singapore | - |
| dc.type.rims | CONF | - |
| dc.description.journalClass | 1 | - |
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
Related Researcher
- Chung, Yong Chae
- COLLEGE OF ENGINEERING (SCHOOL OF MATERIALS SCIENCE AND ENGINEERING)