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Diffusion barrier performance of cyclic-chemical vapor deposited TiN films for copper metalization
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 전형탁 | - |
| dc.date.accessioned | 2021-08-04T10:34:55Z | - |
| dc.date.available | 2021-08-04T10:34:55Z | - |
| dc.date.issued | 19981101 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/81748 | - |
| dc.title | Diffusion barrier performance of cyclic-chemical vapor deposited TiN films for copper metalization | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | ISPSA-98 | - |
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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Related Researcher
- Jeon, Hyeongtag
- COLLEGE OF ENGINEERING (SCHOOL OF MATERIALS SCIENCE AND ENGINEERING)