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홀로그래픽 간섭계를 이용한 가전제품의구조해석 응용 연구
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 장경영 | - |
| dc.date.accessioned | 2021-08-04T11:24:36Z | - |
| dc.date.available | 2021-08-04T11:24:36Z | - |
| dc.date.issued | 1997-07-01 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/83059 | - |
| dc.title | 홀로그래픽 간섭계를 이용한 가전제품의구조해석 응용 연구 | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 재료및 파괴부문 학술대회논문집 | - |
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Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
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