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A microwave plasma jet chemical vapor deposition for diamond film growth

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dc.contributor.authorLin, C.-Y.-
dc.contributor.authorYen, J.-S.-
dc.contributor.authorHsu, H.-Y.-
dc.contributor.authorLin, M.-C.-
dc.date.accessioned2021-08-09T07:15:16Z-
dc.date.available2021-08-09T07:15:16Z-
dc.date.created2021-08-09-
dc.date.issued2019-04-29-
dc.identifier.urihttps://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/84798-
dc.description.abstractThe research and development of a microwave plasma jet chemical vapor deposition for diamond film growth have been carried out in this study. This three-dimensional microwave plasma model helps understanding the operating conditions for the growth of diamond film. This mathematical modeling uses an adaptive finite element numerical method based on different parameters. Plasma simulation has been considered as a numerically stiff problem because of the strong nonlinearity and multi scales crossing. The whole system has been modeled soundly. Also, the thin diamond film has been successfully fabricated according to the identical condition. The SEM image shows that the deposited diamond particles are uniformly distributed on the substrate with the size of 1 μm which might find application in surface hardening and field electron emission.-
dc.language영어-
dc.language.isoen-
dc.publisherThe Korean Institute of Electromagnetic Engineering and Science-
dc.titleA microwave plasma jet chemical vapor deposition for diamond film growth-
dc.typeConference-
dc.contributor.affiliatedAuthorLin, M.-C.-
dc.identifier.scopusid2-s2.0-85068983544-
dc.identifier.bibliographicCitation2019 International Vacuum Electronics Conference (IVEC), pp.1 - 2-
dc.relation.isPartOf2019 International Vacuum Electronics Conference (IVEC)-
dc.relation.isPartOf2019 International Vacuum Electronics Conference (IVEC)-
dc.citation.title2019 International Vacuum Electronics Conference (IVEC)-
dc.citation.startPage1-
dc.citation.endPage2-
dc.citation.conferencePlaceKO-
dc.citation.conferencePlaceParadise Hotl Busan-
dc.citation.conferenceDate2019-04-28-
dc.type.rimsCONF-
dc.description.journalClass1-
dc.identifier.urlhttps://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=8744988-
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