ScholarWorks@Hanyang University: Kim, Hak Sung

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Kim, Hak Sung (김학성)

COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)

Research Area: 복합재료, 반도체 패키징, 테라헤르츠 비파괴 검사, Composite Materials, Semiconductor packaging, Terahertz non-destructive inspection

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Printed electronics:11||Intense pulsed light:8||Terahertz:8||Flash light sintering:8||printed electronics:7||Polymermatrix composites (PMCs):6||Intense pulsed light sintering:5||Sintering:5||테라헤르츠:5||비파괴검사:5||DSSC:4||Nanoparticles:4||Composites:4||flash light sintering:4||Delamination:4||Nondestructive evaluation:4||Copper:4||Adhesion:4||Digital image correlation:4||Terahertz wave:4||Finite element analysis:4||sintering:3||Dynamic property:3||Polypropylene:3||Flash light irradiation:3||printed circuit board (PCB):3||viscoelastic property:3||SAC305:3||Shear angle:3||terahertz:3||Gelation point:3||Finite element analysis (FEA):3||Cure shrinkage:3||3D printing:3||printed electronics(인쇄전자):3||Carbon nanotubes:3||Dielectrometry:3||Electrical properties:3||Addressable conducting network:3||Warpage:3||Carbon fiber:3||silver nanowire:3||flash light sintering(광소결):3||High strain rate:3||Mechanical properties:3||Thinfilm transistor:2||flash light welding:2||Deep Learning:2||TiO2:2||addressable conducting network:2||Semiconductor package:2||Permeability:2||graphene oxide:2||Intense pulsed white light:2||Deep deterministic policy gradient:2||Deep learning:2||warpage simulation:2||wavelength range:2||Carbon nanotube:2||Deep neural network:2||Photothermal dewetting:2||Contact Resistance:2||결함:2||intense pulsed light annealing:2||디지털 이미지 기법:2||intensive plasmonic:2||Copper nanoparticles:2||Cu nanoparticles(구리 나노입자):2||복합재료:2||스플릿 홉킨슨 바:2||Polymer:2||Polymer concrete:2||Woven composite:2||Woven composites:2||Smart cure cycle:2||Convolutional Neural Network:2||Nanoparticle:2||flexible:2||Finite element method:2||Counter electrode:2||Sputtering:2||bandpass filter:2||Printed electronics(인쇄전자):2||Flash light:2||optical filter:2||Dielectric sensor:2||Nondestructive Evaluation:2||Nondestructive Testing:2||Nondestructive testing:2||Flash light sintering (광소결):2||Flash light sintering(광소결):2||Methanol:2||copper nanoparticles:2||Optimal design:2||Optimization:2||Diffusion coefficient:2||Reinforcement learning:2||Electrocatalytic:2||residual stress:2||Microstructure:2||IPL sintering:2||selfhealing:2||Direct methanol fuel cells:2||Terahertz Wave:2||Environmental degradation:2||Terahertz timedomain spectroscopy:2||Moisture content:2||Crimp angle:2||Molecular dynamics:2||surface roughness:2||Thermal residual stress:2||terahertz(테라헤르츠):2||CFRP composites:2||Damage sensing:2||Damping ratio:2||Carbon fiber reinforced polymer concrete:2||thinfilm transistor:2||Thermoplastic resin:2||transfer function method:2||Thickness:2||transparent electrode:2||FRACASCT:2||DSSCs:1||Damage mechanics:1||Damage monitoring:1||Darcy’s law:1||Deep learning and artificial neural network:1||Deep ultraviolet(원 자외선):1||Deeplearning:1||Deepneural network (DNN):1||Defect:1||Degree of crystallinity:1||Delamination(박리):1||Densification(치밀화):1||Deposited thin layer:1||Dielectric layer:1||Digital Image Correlation (DIC):1||Digital Logic Method(Digital Logic):1||Dispersion:1||Dissipation factor(손실계수):1||Distal radius fracture:1||Doping Concentration:1||DyeSensitized Solar Cell (DSSC):1||Dyesensitized solar cell:1||Dyesensitized solar cell (DSSC):1||Dynamic Properties:1||Dynamic compression test:1||Dynamic stiffness distribution:1||Dynamics characteristic:1||EIGEN&apos:1||EMC:1||EMC (Epoxy molding compound):1||EMC Mold#refractive index(굴절률):1||Edge effect:1||Edge tool influence functions:1||Elastic behavior:1||Electric vehicle:1||ElectricThermal Analysis:1||Electrical Conductivity:1||Electrical conductivity:1||Electrical resistance change method:1||Electrical resistance change method (ERCM):1||Electromagnetic property:1||Electrocatalysis:1||Electromyography (EMG):1||End notched flexure (ENF) test:1||Energy:1||Energy storage:1||Epoxy:1||Epoxy molding compound (EMC):1||Epoxy(에폭시):1||Equivalent static load method:1||Extrusion:1||FBG (Fiber Bragg grating) sensor:1||FBG sensor:1||FEA(유한요소해석):1||FRAPCON4:1||FRAPCON4.0P01:1||Fabrics:1||Failure map:1||Failure modes:1||Fatigue:1||Fatigue life:1||Fiber Bragg grating (FBG) sensor:1||Fiber direction:1||Fiber orientation:1||Fiber reinforced composite:1||Fine delamination:1||Finite Element Analysis:1||Finite Element Method (FEM):1||Finiteelementmethod (FEM):1||Flash Light:1||Flash Light Sintering:1||Flash light (IPL):1||Flash light sintering (FLS):1||Flash white light:1||Flash white light(극단파 백색광):1||Flashlight sintering:1||Flashlight:1||Flexibility:1||Flexible substrate:1||Flipchip:1||Forming defect detection:1||Forming load:1||Fracture:1||Fracture envelope:1||Fracture strength:1||Fracture strength(파괴강도):1||Fracture toughness(파괴인성):1||Friction:1||Front bumper assemble component:1||Fuel performance code:1||Functionalized carbon nanotubes (fCNTs):1||GFRP(유리섬유강화플라스틱):1||Galvano Scanner:1||Generative Adversarial Neural Network:1||Glass Fiber Composite:1||Glass Fiber Reinforced Polymer (GFRP):1||Glass fiber reinforced plastic:1||Glass fiber reinforced polymer (GFRP):1||Glass fiberreinforced composites:1||Glass fiberreinforced plastics:1||Glass fiberreinforced polypropylene composites:1||Glassfiberreinforced plastic composites:1||Glucose:1||Glucose sensor:1||Graphene oxide:1||Heat generation:1||Heterostructure:1||High capacity:1||High temperature deformation:1||Highstrength steel:1||Hightemperature properties:1||Hillbased muscle model:1||Hybrid composite:1||Hybrid glass/carbon fiber composite:1||Hydrophilic group:1||Hygroscopic and mechanical properties:1||Hygroscopic characteristic:1||IC package:1||IGZO semiconductor:1||IPL (intense pulsed light):1||IPL annealing(IPL 어닐링):1||Impact behavior:1||Impact damper:1||Impact simulation:1||Impedance spectroscopy:1||In situ monitoring:1||In situ temperature measuring system:1||In vivo muscle stiffness:1||Insitu monitoring:1||Indium gallium zinc oxide semiconductor:1||Inkjet printing:1||Instrumented indentation test:1||Integrated EMG (IEMG):1||Intense pulsed laser:1||Interface adhesion:1||Interfacial strength:1||Interference fitting:1||Intermetallic compounds:1||Iridium oxide:1||Isometric contraction:1||Joining of aluminum tube:1||Lamina/ply:1||Laminated Composite Heating Module:1||Laminated composites:1||Lanthanum strontium cobaltite:1||Laser spallation test:1||Lithium battery:1||Loss factor:1||Low porosity:1||Low temperature:1||Low velocity impact test(저속충격시험):1||Lowtemperature solid oxide fuel cell:1||Lowvelocity impact test:1||Manufacturing process:1||Mean frequency:1||Measurement:1||Mechanical property:1||Mechanical testing:1||Metal:1||Metal alloy nanoparticles:1||Metal oxide:1||MgO nanoparticles:1||Michelson interferometer:1||Microdefect:1||Microstructurebased strengthening model:1||Mixedmode delamination:1||MoSe₂:1||MoS₂:1||Modeling:1||Molecular Dynamics:1||Molecular dynamics(분자동역학):1||Molecular weight:1||Molybdenum:1||MultiD deformation:1||Multidelamination:1||Multilayered flexible printed circuit board:1||Multilevel metallization:1||Multipulse sintering:1||Multiscale:1||Multiscale modeling:1||Multiwalled carbon nanotube:1||Multiwalled carbon nanotubes (MWCNTs):1||Multifunctional:1||Multifunctional composites:1||Multilayer ceramic capacitors:1||Multiple intense pulsed light sintering:1||Muscle fatigue:1||Nanoink:1||Nanoclay:1||Nanoclay(나노클레이):1||Nanoclays:1||Nanocomposite:1||Nanocomposite(나노복합재료):1||Nanocomposites:1||Nanocrystalline:1||Nanoflake:1||Nanoparticlealloys:1||Nanostructure:1||Near infrared(근 적외선):1||Nickel:1||Noise level reduction:1||NonDestructive Evaluation:1||NonDestructive Evaluation(NDE):1||Noncontact:1||Noncontact Test:1||Nondestructive Evaluation(비파괴검사):1||Nondestructive Test:1||Nondestructive evaluation:1||Nondestructive inspection:1||Novel reducing agent:1||Numerical analysis:1||Optical properties:1||Optimization program(최적화 프로그램):1||Oxidation:1||Oxidation resistance:1||Oxide dispersion strengthened Zircaloy4:1||Oxygen evolution reaction:1||Oxygen plasma:1||Oxygen plasma treatment:1||Oxygen reduction reaction (ORR):1||PFA tube:1||PP:1||Package:1||Packing density and resistivity:1||Pad design:1||Paper substrate:1||Partial oxide dispersion strengthened layer:1||Particlereinforcement:1||Passenger airbag:1||Passive component:1||Pattern width and interval:1||PdNPs:1||Pearson correlation coefficient:1||Pedestrian safety:1||Permeability ellipse:1||Permeability(투과도):1||Permittivity:1||Perovskite oxides:1||Photo catalyst:1||PhotoMixer:1||Photocurrent:1||Photoelectrochemistry:1||Photothermal reduction:1||Pipe embedment:1||Plasma treatment:1||Platinum:1||Platinum alloy:1||Poly(Nvinylpyrrolidone):1||Polyetherimide (PEI):1||Polymer concrete sleeper:1||Polymer concrete(폴리머 콘크리트):1||Polypropylene (PP):1||Power conversion system:1||Precursor solution:1||Press fit:1||Printability(인쇄성):1||Printed circuit board:1||Printed electronic:1||Probability map:1||Progressive damage model:1||Progressive failure model:1||Pullout test:1||Pulse intensity:1||Pulsed terahertz wave:1||Quasisolid state dyesensitized solar cells (QDSSCs):1||RVE:1||RVE (Representative Volume Element):1||Radiation:1||Raman Studies:1||Raman spectroscopy(라만 스펙트로스코피):1||Realtime monitoring:1||Recurrence plot:1||Recycled plastic:1||Reduction:1||Refractive Index:1||Reliability:1||Representative volume element (RVE):1||Representative volume element model:1||Representative volume elements (RVE):1||Residual stress(잔류응력):1||Residual/internal stress:1||Resin transfer moulding (RTM):1||Resistivity:1||Reverseoffset printing:1||Rheological property:1||Rolling noise, Moving loads:1||Salt spray test:1||Samariadoped ceria (SDC):1||Sandwich structure:1||Saturation mobility:1||Selfhealing:1||Selfreinforced Polypropylene (SRPP):1||Selfreinforced composite:1||Semicrystalline:1||Semiconductor:1||Semiconductor Package:1||Semiconductor packageMoisture diffusionThermal stressDelamination analysis:1||Semiconductor packages:1||Sensorbased control:1||Separated beam method:1||Shear force:1||Sheet metal forming:1||Sheet resistance(면저항):1||SiC power module:1||Silicon Wafer:1||Silicon heterojunction solar cell:1||Silicon solar cells:1||Silicon wafer substrate:1||Silver NanoInk:1||Silver coated copper coreshell:1||Silver nanoparticles:1||Silver nanowire:1||Silver nanowire(은 나노와이어):1||Sintering process(소결 공정):1||Size effect:1||Smart materials:1||SnO₂:1||Solder:1||Solder bump:1||Solid oxide fuel cells:1||Solution process approch:1||Solutionprocessed:1||Split Hopkinson Pressure Bar (SHPB):1||Split Hopkinson pressure bar:1||SplitHopkinson Pressure Bar (SHPB):1||Splithopkinson pressure bar:1||Square cup deep drawing:1||SrTiO₃:1||Stacking sequence:1||States:1||Steel ring with many teeth:1||Strain energy release rate:1||Strain rate effect:1||Stress–strain curve:1||Structural:1||Structural composites:1||Structural health monitoring (SHM):1||Substrate vacuum heating:1||Substrate warping:1||Supercapacitor:1||Supercapacitors:1||Surface Mount Technology (SMT):1||Surface Roughnes:1||Surface cation migration:1||Surface modification:1||Surface morphology:1||Surface mount technology:1||Surface roughness:1||Sustainable Synthesis:1||Swelling:1||TMD:1||Temperature control:1||Tensile strength:1||Terahertz radiation:1||Terahertz wave(테라헤르츠 파):1||Terahertz waves:1||Textile fabric electrode:1||Thermal analysis:1||Thermal cycling:1||Thermal management:1||Thermoplastic:1||Thermoplastic Olefin(TPO):1||Thermoplastic composite material(열가소성 복합재료):1||Thermoplastic composites:1||Thermoplastic olefin:1||Thin films:1||Threepoint bending:1||Timoshenko beam model(티모쉔코 보 모델):1||Transparent conducting electrode:1||Transparent electrode:1||Triiodide:1||TsaiWu Failure Criterion(TsaiWu):1||Twostep flash light sintering:1||Twostep sintering method:1||Twostep sintering process(2단계 소결 공정):1||UVIR assisted IPL irradiation:1||Ultrafast bonding process:1||Ultraviolet surface modification:1||VARTM:1||Vacuum Assisted Resin Transfer Molding:1||Vacuum assisted resin transfer molding (VARTM):1||Viahole:1||Vibration Test:1||View Factor:1||WSe₂:1||Warpage(휨):1||Wave Approach:1||Weld line:1||Welldispersed Cu nanoparticle paste:1||Wet chemical:1||Woven fabric:1||Woven fabric composites:1||Young&apos:1||Zircaloy4 cladding tube:1||Zircaloy4 tube:1||a vibration method:1||accident tolerant fuel (ATF) cladding:1||adhesion reliability:1||adhesion strength and resistivity:1||adhesively bonded joint:1||alignment:1||analytical model:1||anisotropic shell model:1||bimodal Cu nanoparticles:1||biomechanical test:1||carbon nanotube:1||chalcopyrite:1||chip crack:1||chip strength:1||cladding:1||coatedcladding:1||cobalt oxide:1||composite materials:1||composites:1||conductivity:1||copper and silver nanoink:1||copper microparticles:1||copper nanoparticle:1||copper nanoparticle(구리나노입자):1||copper nanowires:1||copper oxide:1||coverage density:1||creep:1||crystallinity:1||damage sensing:1||damping effect(감쇠 효과):1||deconvolution:1||deep ultraviolet:1||deepUV:1||deeplearning:1||defect:1||design optimization:1||detection:1||die pickup process:1||dynamic characteristics:1||electric vehicle:1||electronics:1||energy release rate:1||energy storage:1||epoxy prepreg:1||equivalent finite element model:1||equivalent modeling:1||experiment:1||fatigue characteristics(피로특성):1||fiber volume fraction:1||fine element analysis:1||finite element analysis:1||flash light:1||flash light irradiation:1||flash light sintering copper nanoparticles:1||flash light sintering(극단파 광소결):1||flash light welding(극단파 광접합):1||flash white light:1||flexible device:1||flexible electronics(유연성 전자소자):1||flexible substrate(유연기판):1||fracture strength:1||gallium oxide:1||graphene oxide(그래핀옥사이드):1||high mobility:1||hybrid supercapacitor:1||hygroscopic thermal behavior:1||impact response:1||insitu monitoring(실시간 계측):1||initial warpage:1||inkjet printing:1||intense pulsed light:1||intense pulsed light (IPL):1||interfacial delamination:1||interfacial strength:1||interfacial wetting:1||intrayarn:1||laser spallation test:1||low porosity:1||machine learning and artificial neural network:1||mechanical behaviors:1||mechanical module:1||metal nanoink(금속잉크):1||micro pattern:1||micro solder ball:1||microelectronic package:1||mobility:1||moisture:1||moisture absorption:1||moisture absorption(흡습):1||multipulse sintering:1||multiscale analysis:1||multilayer PCB film:1||multiwalled carbon nanotube:1||nano particle(나노 입자):1||nanoparticle:1||nanostructure:1||near infrared:1||nearinfrared:1||noncontact measurement:1||nondestructive:1||nondestructive evaluation:1||on/off ratio:1||pad design:1||passive chip:1||phase change(상 변화):1||polymer:1||preheating:1||printed electronic:1||printed electronics(인쇄 전자):1||printed&apos:1||progressive damage analysis:1||prosthetic foot design:1||prosthetics and exoskeletons:1||reactive sintering:1||reduced graphene oxide:1||reduction:1||reflector shape(리플렉터):1||refractive index(굴절율):1||reliability:1||reliability of electrode:1||resistive random access memory:1||retention:1||rheology (레올로지):1||s modulus:1||screw length:1||sheet resistance:1||silver:1||silver nanoparticles:1||silver nanowire(은나노와이어):1||silver nanowires:1||smart cure cycle:1||solar cells:1||spreading tow:1||stress amplification factor:1||stressstrain curve:1||surface plasmon effect:1||tension:1||terahertz waves:1||test:1||thermal residual stress:1||thermal shock test:1||thickness:1||thinfilm:1||toe joint:1||transient wave propagation:1||transparent conductive composite:1||transparent electrode(투명전극):1||ultrafast annealing:1||ultrathin chip:1||ultrathin memory chip:1||ultrafast fabrication process:1||ultrathin IC chip:1||unicortical fixation:1||vibration analysis(진동 해석):1||vibration test method:1||vibration touch panel:1||virtual crackclosure technique (VCCT):1||viscoelasticity:1||void:1||volar locking plate:1||vulnerability assessment:1||wafer thinning:1||warapge of PCB:1||wavelength range (파장영역):1||wire explosion:1||wire rope:1||woven composite:1||zinc oxynitride:1||갈바노 스캐너:1||고전 적층판 이론 Carbon fiber composite:1||디컨벌루션 nondestructive evaluation:1||딥러닝:1||미세기공:1||미세박리:1||반도체 패키지:1||비접촉검사:1||소결:1||위치 감응형 전극 네트워크:1||유리섬유 복합재료:1||은 나노 잉크:1||접촉저항:1||진공 수지 이송 성형법:1||칩 정렬:1||컨볼루션 신경망:1||탄소섬유 복합재료:1||폴리머:1||폴리프로필렌 Split Hopkinson pressure bar:1||표면거칠기:1||&apos:1||피어슨 상관계수:1||1octanethiol:1||3D Digital Image Correlation:1||3D representative volume element model:1||3DTow/LFT composite:1||Accelerated degradation tests:1||Accident tolerant fuel:1||Accident tolerant fuel (ATF):1||Actions:1||Actual measurement condition:1||Addressable Conducting Network:1||Addressable Conducting Network (ACN):1||Adhesion (접착):1||Adhesion strength:1||Adhesive tape:1||Adhesivebonded joint(접착 조인트):1||Adhesively bonded joint:1||Advanced high strength steel:1||Ag NanowiresPolydimethylsiloxane composites:1||Ag coated Cu paste:1||Ag mesh film:1||Ag sinteredjoint:1||Anisotropic shell model:1||Anisotropic viscoelastic property:1||AnoGAN:1||Anomaly Detection:1||Antioxidant activity:1||Assembly defect rate:1||Asymmetric double cantilever beam (ADCB):1||Automobile hood:1||Auxetic structure:1||Bpillar:1||Ballooning:1||Bicycle Frame:1||Bimodal Cu nanoparticles (NPs):1||Bio fuel cell:1||Biofuel cell:1||Birefringence:1||Bismuth sulfide nanowires (Bi₂S₃NWs):1||Bi₂S₃ nanorod (NR):1||Bi₂S₃ nanorods (NRs):1||Bolttype piezo sensor:1||Bond characteristics:1||Buckling:1||Building structures:1||CBD:1||CEs:1||CFD simulation:1||CIGS thin film:1||CLT:1||CNT(탄소나노튜브):1||Capacitor:1||Carbon:1||Carbon FiberReinforced Composite:1||Carbon fiber nylon composite:1||Carbon fiber polypropylene composite:1||Carbon fiber polypropylene/carbon nanotube nanocomposite:1||Carbon fiber reinforced plastic (CFRP):1||Carbon fiber reinforced plastic composites (CFRP):1||Carbon fiber reinforced plastics:1||Carbon fiber reinforced polymer (CFRP):1||Carbon fiber reinforced polymer composite:1||Carbon fiber reinforced thermoplastic (CFRTP):1||Carbon fiberreinforced composites:1||Carbon fiberreinforced plastics (CFRP):1||Carbon fibre:1||Carbon fibres:1||Carbon metallic films:1||Carbonfibe:1||Carbonfiberreinforced polymer (CFRP):1||Carbonnanotube:1||Carbonous metallic heterostructure composite film (CMHCs):1||Catalytic Activity:1||Cement hydration:1||Chemical solution deposition:1||Chip Alignment:1||Cladding deformation:1||Classical laminate plate theory:1||Clitoria ternatea:1||CoNi₂S₄:1||Cobalt oxide:1||Cohesive zone method:1||Cohesive zone model:1||Cold storage:1||Composite:1||Composite materials:1||Computational mechanics:1||Computer controlled optical surfacing:1||Concentration gradient:1||Conductive paste:1||Consolidation temperature:1||Continuous:1||Continuous carbon fiber filament (CCF filament):1||Continuous terahertz wave:1||Convolutional neural network:1||Cooling rate:1||Copper nano:1||Copper nanoink:1||Copper nanoink(구리 나노 잉크):1||Copper nanoparticles:1||Copper nanoparticle:1||Copper nanoparticle/microparticle ink:1||Copper nanoparticles(구리 나노 입자):1||Copper precursor:1||Corrosion:1||Crack type:1||Creep properties:1||Crystalline phase:1||Crystallinity:1||Crystallization:1||Cu micro/Ag nanohybrid ink:1||Cu nanoink(구리 나노잉크):1||Cu nano/micro particle:1||Cu nano/micro particles:1||Cu nanoparticle:1||Cu nanoparticle paste:1||Cu nanoparticles(구리나노입자):1||CuNanoInk:1||Cu/Ag hybridink (은/구리 하이브리드 잉크):1||Cure behaviour:1||Curve fitting#Flow front:1||Curved sandwich structure:1||

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