Lundh; J.S.; Song; Y.; Chatterjee; B.; Baca; A.G.; Kaplar; R.J., et al.
ArticleIssue Date2019CitationASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2019PublisherAmerican Society of Mechanical Engineers (ASME)