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Lamination contact bonding and mechanical detaching of PI film for manufacturing of flexible OLED displays
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Yang, Seung-yeol | - |
| dc.contributor.author | S.-Y. | - |
| dc.contributor.author | Kim, Chan-soo | - |
| dc.contributor.author | C.-S. | - |
| dc.contributor.author | Choi, Jongsun | - |
| dc.contributor.author | J.-S. | - |
| dc.contributor.author | Kim, Yong-seog | - |
| dc.contributor.author | Y.-S. | - |
| dc.date.available | 2021-03-17T08:42:23Z | - |
| dc.date.created | 2021-02-26 | - |
| dc.date.issued | 2018 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/13009 | - |
| dc.title | Lamination contact bonding and mechanical detaching of PI film for manufacturing of flexible OLED displays | - |
| dc.type | Article | - |
| dc.contributor.affiliatedAuthor | Choi, Jongsun | - |
| dc.contributor.affiliatedAuthor | Kim, Yong-seog | - |
| dc.identifier.doi | 10.1002/sdtp.12317 | - |
| dc.identifier.scopusid | 2-s2.0-85054005233 | - |
| dc.identifier.bibliographicCitation | Digest of Technical Papers - SID International Symposium, v.49, no.1, pp.1597 - 1600 | - |
| dc.relation.isPartOf | Digest of Technical Papers - SID International Symposium | - |
| dc.citation.title | Digest of Technical Papers - SID International Symposium | - |
| dc.citation.volume | 49 | - |
| dc.citation.number | 1 | - |
| dc.citation.startPage | 1597 | - |
| dc.citation.endPage | 1600 | - |
| dc.type.rims | ART | - |
| dc.type.docType | Conference Paper | - |
| dc.description.journalClass | 1 | - |
| dc.description.journalRegisteredClass | scopus | - |
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