Thermoelectric Characteristics of n-Type Bi2Te3 and p-Type Sb2Te3 Thin Films Prepared by Co-Evaporation and Annealing for Thermopile Sensor Applications
DC Field | Value | Language |
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dc.contributor.author | Kim, Jae-Hwan | - |
dc.contributor.author | Choi, Jung-Yeol | - |
dc.contributor.author | Bae, Jae-Man | - |
dc.contributor.author | Kim, Min-Young | - |
dc.contributor.author | Oh, Tae-Sung | - |
dc.date.accessioned | 2021-11-11T04:44:28Z | - |
dc.date.available | 2021-11-11T04:44:28Z | - |
dc.date.created | 2021-11-10 | - |
dc.date.issued | 2013 | - |
dc.identifier.issn | 1345-9678 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/17348 | - |
dc.description.abstract | A thermoelectric thin-film device consisting of n-type Bi2Te3 and p-type Sb2Te3 thin-film legs was prepared on a glass substrate by using co-evaporation and annealing process. The Seebeck coefficient and the power factor of the co-evaporated Bi2Te3 film were -30 mu V/K and 0.7 x 10(-4) W/K-2.m, respectively, and became substantially improved to -160 mu V/K and 16 x 10(-4) W/K-2.m by annealing at 400 degrees C for 20 min. While the Seebeck coefficient of the co-evaporated Sb2Te3 thin film was 72 mu V/K, it increased significantly to 165-142 mu V/K by annealing at 200-400 degrees C for 20 min. A maximum power factor of 25 x 10(-4) W/K-2.m was achieved for the co-evaporated Sb2Te3 film by annealing at 400 degrees C for 20 min. A thermopile sensor consisting of 10 pairs of n-type Bi2Te3 and p-type Sb2Te3 thin-film legs exhibited a sensitivity of 2.7 mV/K. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | JAPAN INST METALS | - |
dc.subject | BISMUTH-TELLURIDE | - |
dc.subject | FABRICATION | - |
dc.subject | MICROSTRUCTURES | - |
dc.subject | TECHNOLOGIES | - |
dc.subject | DEPOSITION | - |
dc.title | Thermoelectric Characteristics of n-Type Bi2Te3 and p-Type Sb2Te3 Thin Films Prepared by Co-Evaporation and Annealing for Thermopile Sensor Applications | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Oh, Tae-Sung | - |
dc.identifier.doi | 10.2320/matertrans.M2013010 | - |
dc.identifier.scopusid | 2-s2.0-84875728791 | - |
dc.identifier.wosid | 000325707000033 | - |
dc.identifier.bibliographicCitation | MATERIALS TRANSACTIONS, v.54, no.4, pp.618 - 625 | - |
dc.relation.isPartOf | MATERIALS TRANSACTIONS | - |
dc.citation.title | MATERIALS TRANSACTIONS | - |
dc.citation.volume | 54 | - |
dc.citation.number | 4 | - |
dc.citation.startPage | 618 | - |
dc.citation.endPage | 625 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Metallurgy & Metallurgical Engineering | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Metallurgy & Metallurgical Engineering | - |
dc.subject.keywordPlus | BISMUTH-TELLURIDE | - |
dc.subject.keywordPlus | FABRICATION | - |
dc.subject.keywordPlus | MICROSTRUCTURES | - |
dc.subject.keywordPlus | TECHNOLOGIES | - |
dc.subject.keywordPlus | DEPOSITION | - |
dc.subject.keywordAuthor | thermoelectric sensor | - |
dc.subject.keywordAuthor | thermopile | - |
dc.subject.keywordAuthor | thin film | - |
dc.subject.keywordAuthor | co-evaporation | - |
dc.subject.keywordAuthor | annealing | - |
dc.subject.keywordAuthor | bismuth telluride | - |
dc.subject.keywordAuthor | antimony telluride | - |
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