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Thermoelectric Characteristics of n-Type Bi2Te3 and p-Type Sb2Te3 Thin Films Prepared by Co-Evaporation and Annealing for Thermopile Sensor Applications

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dc.contributor.authorKim, Jae-Hwan-
dc.contributor.authorChoi, Jung-Yeol-
dc.contributor.authorBae, Jae-Man-
dc.contributor.authorKim, Min-Young-
dc.contributor.authorOh, Tae-Sung-
dc.date.accessioned2021-11-11T04:44:28Z-
dc.date.available2021-11-11T04:44:28Z-
dc.date.created2021-11-10-
dc.date.issued2013-
dc.identifier.issn1345-9678-
dc.identifier.urihttps://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/17348-
dc.description.abstractA thermoelectric thin-film device consisting of n-type Bi2Te3 and p-type Sb2Te3 thin-film legs was prepared on a glass substrate by using co-evaporation and annealing process. The Seebeck coefficient and the power factor of the co-evaporated Bi2Te3 film were -30 mu V/K and 0.7 x 10(-4) W/K-2.m, respectively, and became substantially improved to -160 mu V/K and 16 x 10(-4) W/K-2.m by annealing at 400 degrees C for 20 min. While the Seebeck coefficient of the co-evaporated Sb2Te3 thin film was 72 mu V/K, it increased significantly to 165-142 mu V/K by annealing at 200-400 degrees C for 20 min. A maximum power factor of 25 x 10(-4) W/K-2.m was achieved for the co-evaporated Sb2Te3 film by annealing at 400 degrees C for 20 min. A thermopile sensor consisting of 10 pairs of n-type Bi2Te3 and p-type Sb2Te3 thin-film legs exhibited a sensitivity of 2.7 mV/K.-
dc.language영어-
dc.language.isoen-
dc.publisherJAPAN INST METALS-
dc.subjectBISMUTH-TELLURIDE-
dc.subjectFABRICATION-
dc.subjectMICROSTRUCTURES-
dc.subjectTECHNOLOGIES-
dc.subjectDEPOSITION-
dc.titleThermoelectric Characteristics of n-Type Bi2Te3 and p-Type Sb2Te3 Thin Films Prepared by Co-Evaporation and Annealing for Thermopile Sensor Applications-
dc.typeArticle-
dc.contributor.affiliatedAuthorOh, Tae-Sung-
dc.identifier.doi10.2320/matertrans.M2013010-
dc.identifier.scopusid2-s2.0-84875728791-
dc.identifier.wosid000325707000033-
dc.identifier.bibliographicCitationMATERIALS TRANSACTIONS, v.54, no.4, pp.618 - 625-
dc.relation.isPartOfMATERIALS TRANSACTIONS-
dc.citation.titleMATERIALS TRANSACTIONS-
dc.citation.volume54-
dc.citation.number4-
dc.citation.startPage618-
dc.citation.endPage625-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.description.journalClass1-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaMetallurgy & Metallurgical Engineering-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryMetallurgy & Metallurgical Engineering-
dc.subject.keywordPlusBISMUTH-TELLURIDE-
dc.subject.keywordPlusFABRICATION-
dc.subject.keywordPlusMICROSTRUCTURES-
dc.subject.keywordPlusTECHNOLOGIES-
dc.subject.keywordPlusDEPOSITION-
dc.subject.keywordAuthorthermoelectric sensor-
dc.subject.keywordAuthorthermopile-
dc.subject.keywordAuthorthin film-
dc.subject.keywordAuthorco-evaporation-
dc.subject.keywordAuthorannealing-
dc.subject.keywordAuthorbismuth telluride-
dc.subject.keywordAuthorantimony telluride-
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