Improvement of electrical and thermal characteristics of nano-micro epoxy composite
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Cho, S.-H. | - |
dc.contributor.author | Kim, Y.-M. | - |
dc.contributor.author | Kwon, J.-H. | - |
dc.contributor.author | Lim, K.-J. | - |
dc.contributor.author | Jung, E.-H. | - |
dc.contributor.author | Lee, H.-K. | - |
dc.contributor.author | Shin, P.-S. | - |
dc.date.accessioned | 2021-12-15T04:43:18Z | - |
dc.date.available | 2021-12-15T04:43:18Z | - |
dc.date.created | 2021-12-10 | - |
dc.date.issued | 2011 | - |
dc.identifier.issn | 1229-7607 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/20534 | - |
dc.description.abstract | Polymer nanocomposite has been attracting more attention as a new insulation material because homogeneous dispersion of nano-sized inorganic fillers can improve various properties significantly. In this paper, various kinds of epoxy-based nanocomposites were made, and the AC breakdown strengths of Nano filler and micro-SiO2 filler mixtures of epoxy-based composites were analyzed using sphere-to-sphere electrodes. Moreover, nano- and microfiller combinations were investigated as an approach to practical application of nanocomposite insulation materials. Its composition ratio was 100 (resin):82 (hardener):1.5 (accelerator). AC breakdown tests were performed at room temperature (25°C), 80°C, and 100°C in the vicinity of Tg (90°C). Thermal conductivity was measured using TC-30 © 2011 KIEEME. All rights reserved. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | Korean Institute of Electrical and Electronic Material Engineers | - |
dc.title | Improvement of electrical and thermal characteristics of nano-micro epoxy composite | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Shin, P.-S. | - |
dc.identifier.doi | 10.4313/TEEM.2011.12.4.160 | - |
dc.identifier.scopusid | 2-s2.0-84930472175 | - |
dc.identifier.bibliographicCitation | Transactions on Electrical and Electronic Materials, v.12, no.4, pp.160 - 163 | - |
dc.relation.isPartOf | Transactions on Electrical and Electronic Materials | - |
dc.citation.title | Transactions on Electrical and Electronic Materials | - |
dc.citation.volume | 12 | - |
dc.citation.number | 4 | - |
dc.citation.startPage | 160 | - |
dc.citation.endPage | 163 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.identifier.kciid | ART001584654 | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scopus | - |
dc.description.journalRegisteredClass | kci | - |
dc.subject.keywordAuthor | Epoxy | - |
dc.subject.keywordAuthor | Nanocomposite | - |
dc.subject.keywordAuthor | Thermal conductivity | - |
dc.subject.keywordAuthor | Thermal expansion coefficient | - |
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