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Improvement of electrical and thermal characteristics of nano-micro epoxy composite

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dc.contributor.authorCho, S.-H.-
dc.contributor.authorKim, Y.-M.-
dc.contributor.authorKwon, J.-H.-
dc.contributor.authorLim, K.-J.-
dc.contributor.authorJung, E.-H.-
dc.contributor.authorLee, H.-K.-
dc.contributor.authorShin, P.-S.-
dc.date.accessioned2021-12-15T04:43:18Z-
dc.date.available2021-12-15T04:43:18Z-
dc.date.created2021-12-10-
dc.date.issued2011-
dc.identifier.issn1229-7607-
dc.identifier.urihttps://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/20534-
dc.description.abstractPolymer nanocomposite has been attracting more attention as a new insulation material because homogeneous dispersion of nano-sized inorganic fillers can improve various properties significantly. In this paper, various kinds of epoxy-based nanocomposites were made, and the AC breakdown strengths of Nano filler and micro-SiO2 filler mixtures of epoxy-based composites were analyzed using sphere-to-sphere electrodes. Moreover, nano- and microfiller combinations were investigated as an approach to practical application of nanocomposite insulation materials. Its composition ratio was 100 (resin):82 (hardener):1.5 (accelerator). AC breakdown tests were performed at room temperature (25°C), 80°C, and 100°C in the vicinity of Tg (90°C). Thermal conductivity was measured using TC-30 © 2011 KIEEME. All rights reserved.-
dc.language영어-
dc.language.isoen-
dc.publisherKorean Institute of Electrical and Electronic Material Engineers-
dc.titleImprovement of electrical and thermal characteristics of nano-micro epoxy composite-
dc.typeArticle-
dc.contributor.affiliatedAuthorShin, P.-S.-
dc.identifier.doi10.4313/TEEM.2011.12.4.160-
dc.identifier.scopusid2-s2.0-84930472175-
dc.identifier.bibliographicCitationTransactions on Electrical and Electronic Materials, v.12, no.4, pp.160 - 163-
dc.relation.isPartOfTransactions on Electrical and Electronic Materials-
dc.citation.titleTransactions on Electrical and Electronic Materials-
dc.citation.volume12-
dc.citation.number4-
dc.citation.startPage160-
dc.citation.endPage163-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.identifier.kciidART001584654-
dc.description.journalClass1-
dc.description.journalRegisteredClassscopus-
dc.description.journalRegisteredClasskci-
dc.subject.keywordAuthorEpoxy-
dc.subject.keywordAuthorNanocomposite-
dc.subject.keywordAuthorThermal conductivity-
dc.subject.keywordAuthorThermal expansion coefficient-
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