Detailed Information

Cited 0 time in webofscience Cited 0 time in scopus
Metadata Downloads

Contact resistance variation in top-contact organic thin-film transistors with the deposition rate of Au source/drain electrodes

Full metadata record
DC Field Value Language
dc.contributor.authorPark, Jaehoon-
dc.contributor.authorKang, Jong Mook-
dc.contributor.authorKim, Dong Wook-
dc.contributor.authorChoi, Jong Sun-
dc.date.accessioned2021-12-17T01:42:07Z-
dc.date.available2021-12-17T01:42:07Z-
dc.date.created2021-12-16-
dc.date.issued2010-09-01-
dc.identifier.issn0040-6090-
dc.identifier.urihttps://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/20716-
dc.description.abstractWe investigated the effect of the deposition rate of Au source/drain electrodes on the contact resistance of the top-contact organic thin-film transistors (OTFTs). For the formation of source/drain contacts, Au was thermally deposited at the different rates of 0.5, 1.0, 5.0, and 13.0 angstrom/s. With increasing the Au deposition rate, the contact resistance extracted at the gate voltage of -30 V could be reduced from 14 x 10(6) to 2.4 x 10(6) Omega, resulting in the characteristic improvements of the top-contact OTFT. It is also found that the contact resistance significantly affects the off-state currents of the device having the short channel length of 10 pm. The control of the deposition rate of source/drain electrodes is suggested to optimize the contact properties of the top-contact OTFTs as well as the device performance. (C) 2010 Elsevier B.V. All rights reserved.-
dc.language영어-
dc.language.isoen-
dc.publisherELSEVIER SCIENCE SA-
dc.subjectMOBILITY-
dc.titleContact resistance variation in top-contact organic thin-film transistors with the deposition rate of Au source/drain electrodes-
dc.typeArticle-
dc.contributor.affiliatedAuthorChoi, Jong Sun-
dc.identifier.doi10.1016/j.tsf.2010.03.168-
dc.identifier.scopusid2-s2.0-77956058251-
dc.identifier.wosid000282242600020-
dc.identifier.bibliographicCitationTHIN SOLID FILMS, v.518, no.22, pp.6232 - 6235-
dc.relation.isPartOfTHIN SOLID FILMS-
dc.citation.titleTHIN SOLID FILMS-
dc.citation.volume518-
dc.citation.number22-
dc.citation.startPage6232-
dc.citation.endPage6235-
dc.type.rimsART-
dc.type.docTypeArticle; Proceedings Paper-
dc.description.journalClass1-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaPhysics-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryMaterials Science, Coatings & Films-
dc.relation.journalWebOfScienceCategoryPhysics, Applied-
dc.relation.journalWebOfScienceCategoryPhysics, Condensed Matter-
dc.subject.keywordPlusMOBILITY-
dc.subject.keywordAuthorOrganic thin-film transistors-
dc.subject.keywordAuthorContact resistance-
dc.subject.keywordAuthorVacuum thermal evaporation-
dc.subject.keywordAuthorSurface current-
Files in This Item
There are no files associated with this item.
Appears in
Collections
College of Engineering > School of Electronic & Electrical Engineering > 1. Journal Articles

qrcode

Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.

Altmetrics

Total Views & Downloads

BROWSE