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Flip-chip process using heat transfer from an induction-heating film

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dc.contributor.authorOh, Tae-Sung-
dc.contributor.authorLee, Kwang-Yong-
dc.contributor.authorLee, Yoon-Hee-
dc.contributor.authorJung, Boo-Yang-
dc.date.accessioned2022-01-03T05:43:02Z-
dc.date.available2022-01-03T05:43:02Z-
dc.date.created2021-12-28-
dc.date.issued2009-06-
dc.identifier.issn1598-9623-
dc.identifier.urihttps://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/21842-
dc.description.abstractA new flip-chip technology to attach an IC chip directly to a substrate was studied using the heat transfer from an induction-heating film in an AC magnetic field. When applying a magnetic field of 230 Oe at 14 kHz, the temperature of a 600 mu m-thick 5 mm x 5 mm Cu induction-heating film reached 250 A degrees C within 60 s. The temperature of the glass substrate used in this process was kept below 118 A degrees C at a distance of 1,350 mu m from the Cu induction-heating film, which was maintained at 250 A degrees C, implying that damage to a substrate can be minimized with the flip-chip process using heat transfer from an induction-heating film. Flip-chip bonding was successfully accomplished with the reflow of Sn-3.5Ag solder bumps by applying a magnetic field of 230 Oe at 14 kHz for 120 s to a Cu induction-heating film.-
dc.language영어-
dc.language.isoen-
dc.publisherKOREAN INST METALS MATERIALS-
dc.subjectLEAD-FREE SOLDERS-
dc.subjectCONTACT RESISTANCE-
dc.subjectINTERCONNECTION-
dc.subjectRELIABILITY-
dc.subjectREFLOW-
dc.titleFlip-chip process using heat transfer from an induction-heating film-
dc.typeArticle-
dc.contributor.affiliatedAuthorOh, Tae-Sung-
dc.identifier.doi10.1007/s12540-009-0479-8-
dc.identifier.scopusid2-s2.0-77955134466-
dc.identifier.wosid000267786600019-
dc.identifier.bibliographicCitationMETALS AND MATERIALS INTERNATIONAL, v.15, no.3, pp.479 - 485-
dc.relation.isPartOfMETALS AND MATERIALS INTERNATIONAL-
dc.citation.titleMETALS AND MATERIALS INTERNATIONAL-
dc.citation.volume15-
dc.citation.number3-
dc.citation.startPage479-
dc.citation.endPage485-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.identifier.kciidART001354337-
dc.description.journalClass1-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.description.journalRegisteredClasskci-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalResearchAreaMetallurgy & Metallurgical Engineering-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.relation.journalWebOfScienceCategoryMetallurgy & Metallurgical Engineering-
dc.subject.keywordPlusLEAD-FREE SOLDERS-
dc.subject.keywordPlusCONTACT RESISTANCE-
dc.subject.keywordPlusINTERCONNECTION-
dc.subject.keywordPlusRELIABILITY-
dc.subject.keywordPlusREFLOW-
dc.subject.keywordAuthorflip chip-
dc.subject.keywordAuthorinduction heating-
dc.subject.keywordAuthorfilm-
dc.subject.keywordAuthorsolder bump-
dc.subject.keywordAuthorsolder reflow-
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