Flip-chip process using heat transfer from an induction-heating film
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Oh, Tae-Sung | - |
dc.contributor.author | Lee, Kwang-Yong | - |
dc.contributor.author | Lee, Yoon-Hee | - |
dc.contributor.author | Jung, Boo-Yang | - |
dc.date.accessioned | 2022-01-03T05:43:02Z | - |
dc.date.available | 2022-01-03T05:43:02Z | - |
dc.date.created | 2021-12-28 | - |
dc.date.issued | 2009-06 | - |
dc.identifier.issn | 1598-9623 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/21842 | - |
dc.description.abstract | A new flip-chip technology to attach an IC chip directly to a substrate was studied using the heat transfer from an induction-heating film in an AC magnetic field. When applying a magnetic field of 230 Oe at 14 kHz, the temperature of a 600 mu m-thick 5 mm x 5 mm Cu induction-heating film reached 250 A degrees C within 60 s. The temperature of the glass substrate used in this process was kept below 118 A degrees C at a distance of 1,350 mu m from the Cu induction-heating film, which was maintained at 250 A degrees C, implying that damage to a substrate can be minimized with the flip-chip process using heat transfer from an induction-heating film. Flip-chip bonding was successfully accomplished with the reflow of Sn-3.5Ag solder bumps by applying a magnetic field of 230 Oe at 14 kHz for 120 s to a Cu induction-heating film. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | KOREAN INST METALS MATERIALS | - |
dc.subject | LEAD-FREE SOLDERS | - |
dc.subject | CONTACT RESISTANCE | - |
dc.subject | INTERCONNECTION | - |
dc.subject | RELIABILITY | - |
dc.subject | REFLOW | - |
dc.title | Flip-chip process using heat transfer from an induction-heating film | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Oh, Tae-Sung | - |
dc.identifier.doi | 10.1007/s12540-009-0479-8 | - |
dc.identifier.scopusid | 2-s2.0-77955134466 | - |
dc.identifier.wosid | 000267786600019 | - |
dc.identifier.bibliographicCitation | METALS AND MATERIALS INTERNATIONAL, v.15, no.3, pp.479 - 485 | - |
dc.relation.isPartOf | METALS AND MATERIALS INTERNATIONAL | - |
dc.citation.title | METALS AND MATERIALS INTERNATIONAL | - |
dc.citation.volume | 15 | - |
dc.citation.number | 3 | - |
dc.citation.startPage | 479 | - |
dc.citation.endPage | 485 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.identifier.kciid | ART001354337 | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.description.journalRegisteredClass | kci | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Metallurgy & Metallurgical Engineering | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Metallurgy & Metallurgical Engineering | - |
dc.subject.keywordPlus | LEAD-FREE SOLDERS | - |
dc.subject.keywordPlus | CONTACT RESISTANCE | - |
dc.subject.keywordPlus | INTERCONNECTION | - |
dc.subject.keywordPlus | RELIABILITY | - |
dc.subject.keywordPlus | REFLOW | - |
dc.subject.keywordAuthor | flip chip | - |
dc.subject.keywordAuthor | induction heating | - |
dc.subject.keywordAuthor | film | - |
dc.subject.keywordAuthor | solder bump | - |
dc.subject.keywordAuthor | solder reflow | - |
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