Electrodeposition of palladium on the copper lead frame: Electrode reaction characteristics and the effects of primary additives
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Jin-Woo | - |
dc.contributor.author | Ju, Jeh-Beck | - |
dc.contributor.author | Kim, Joong-Do | - |
dc.date.accessioned | 2022-01-14T07:41:30Z | - |
dc.date.available | 2022-01-14T07:41:30Z | - |
dc.date.created | 2022-01-14 | - |
dc.date.issued | 2007-11 | - |
dc.identifier.issn | 0256-1115 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/23524 | - |
dc.description.abstract | This study is mainly concerned with the electrodeposition of palladium on the copper alloy lead frame used for semiconductor assembly process. The role and effect of additives on palladium electrodeposition were studied by using various electrochemical methods. Ortho-formylbenzenesulfonic acid as a primary additive was used in palladium plating on the lead frame in this study. The electrochemical characteristics of electrode reaction were measured by the hanging mercury drop electrode for electrochemical system and the qualifies of the plated surface of lead frames were also examined. The additive agent in Pd solution could have been classified as the grain refiner. It acted as the electroactive species, which increased the polarization and decreased the roughness, by adsorption on the electrode in palladium pre-plated process. The reduction of palladium ion was identified to be an irreversible reaction and the diffusion coefficient of palladium ion and the reaction rate constant were obtained from chronopotentiometry experiment. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | KOREAN INSTITUTE CHEMICAL ENGINEERS | - |
dc.title | Electrodeposition of palladium on the copper lead frame: Electrode reaction characteristics and the effects of primary additives | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | Ju, Jeh-Beck | - |
dc.identifier.doi | 10.1007/s11814-007-0105-8 | - |
dc.identifier.wosid | 000251423100008 | - |
dc.identifier.bibliographicCitation | KOREAN JOURNAL OF CHEMICAL ENGINEERING, v.24, no.6, pp.960 - 964 | - |
dc.relation.isPartOf | KOREAN JOURNAL OF CHEMICAL ENGINEERING | - |
dc.citation.title | KOREAN JOURNAL OF CHEMICAL ENGINEERING | - |
dc.citation.volume | 24 | - |
dc.citation.number | 6 | - |
dc.citation.startPage | 960 | - |
dc.citation.endPage | 964 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.identifier.kciid | ART001203496 | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.description.journalRegisteredClass | kci | - |
dc.relation.journalResearchArea | Chemistry | - |
dc.relation.journalResearchArea | Engineering | - |
dc.relation.journalWebOfScienceCategory | Chemistry, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Engineering, Chemical | - |
dc.subject.keywordAuthor | palladium | - |
dc.subject.keywordAuthor | electrodeposition | - |
dc.subject.keywordAuthor | lead frame | - |
dc.subject.keywordAuthor | additives | - |
dc.subject.keywordAuthor | electrochemistry | - |
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
94, Wausan-ro, Mapo-gu, Seoul, 04066, Korea02-320-1314
COPYRIGHT 2020 HONGIK UNIVERSITY. ALL RIGHTS RESERVED.
Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.