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Effects of organic additives on residual stress and surface roughness of electroplated copper for flexible PCB
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Jongsoo Kim | - |
| dc.contributor.author | Heesan Kim | - |
| dc.date.accessioned | 2022-01-14T08:42:32Z | - |
| dc.date.available | 2022-01-14T08:42:32Z | - |
| dc.date.created | 2022-01-14 | - |
| dc.date.issued | 2007 | - |
| dc.identifier.issn | 1598-6462 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/23912 | - |
| dc.publisher | 한국부식방식학회 | - |
| dc.title | Effects of organic additives on residual stress and surface roughness of electroplated copper for flexible PCB | - |
| dc.title.alternative | Effects of organic additives on residual stress and surface roughness of electroplated copper for flexible PCB | - |
| dc.type | Article | - |
| dc.contributor.affiliatedAuthor | Heesan Kim | - |
| dc.identifier.bibliographicCitation | CORROSION SCIENCE AND TECHNOLOGY, v.6, no.4, pp.154 - 158 | - |
| dc.relation.isPartOf | CORROSION SCIENCE AND TECHNOLOGY | - |
| dc.citation.title | CORROSION SCIENCE AND TECHNOLOGY | - |
| dc.citation.volume | 6 | - |
| dc.citation.number | 4 | - |
| dc.citation.startPage | 154 | - |
| dc.citation.endPage | 158 | - |
| dc.type.rims | ART | - |
| dc.identifier.kciid | ART001079315 | - |
| dc.description.journalClass | 2 | - |
| dc.description.journalRegisteredClass | kci | - |
| dc.subject.keywordAuthor | flexible printed circuit board | - |
| dc.subject.keywordAuthor | electroplating | - |
| dc.subject.keywordAuthor | copper | - |
| dc.subject.keywordAuthor | additive | - |
| dc.subject.keywordAuthor | residual stress | - |
| dc.subject.keywordAuthor | surface roughness†Corresponding author: heesankim@yahoo.co.kr1. IntroductionIn general | - |
| dc.subject.keywordAuthor | FPCB (Flexible Printed circuit Board) consists of a polyimide film as an insul | - |
| dc.subject.keywordAuthor | flexible printed circuit board | - |
| dc.subject.keywordAuthor | electroplating | - |
| dc.subject.keywordAuthor | copper | - |
| dc.subject.keywordAuthor | additive | - |
| dc.subject.keywordAuthor | residual stress | - |
| dc.subject.keywordAuthor | surface roughness†Corresponding author: heesankim@yahoo.co.kr1. IntroductionIn general | - |
| dc.subject.keywordAuthor | FPCB (Flexible Printed circuit Board) consists of a polyimide film as an insul | - |
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Related Researcher
- Kim, Hee san
- Science & Technology (Department of Nanomaterials Engineering)